As for copper in copper roller plating solution, it is a kind of impurity that is easy to increase. Moreover, it is the same as metal impurities such as iron, and the conductivity of the solution will be reduced. In this way, it will narrow the bright chromium layer area of our copper roller, and its covering capacity will be reduced. In addition, because it is actually the roller belongs to the inner hole, because of the corrosion and oxidation of chromic acid during electroplating and contamination of the plating solution.

For copper impurities in the copper roller, when the mass concentration of copper impurities is relatively high, the current density can be directly adjusted to 18A/dm2 or 20A/dm2 when the bath temperature remains unchanged. In this way, it is certain that there will not be a series of obvious effects on the coating and so on.

Furthermore, for copper impurities in the copper roller, in fact, the mass concentration of chromium anhydride can be directly adjusted to reach the upper limit of the process, that is, 250g/L, for reducing the mass concentration of impurities, so as to improve the quality of coating. However, as for the mass concentration of copper impurities, it should be controlled below 6g/L. In this way, it is also an important factor in copper roller chromium plating.

For the copper impurities in the copper roller, we can actually use the following method to control, and then to slow down the accumulation of copper impurities, so as to extend the service life of its plating solution.

First of all, is to roll on the inner wall, directly coated with a layer of insulating paint film, after 24 hours of drying after direct electroplating. As far as its film is concerned, it can certainly prevent chromic acid from corroding and oxidizing our inner wall copper.

In addition, for the copper roller, its fixture is actually made of iron materials, if the two ends of the plywood and its central screw fixed, that is to say, do not use copper; In addition, for the processing of copper roller, on its midway power failure, we should immediately remove the plating, in order to prevent a long time into the plating solution, resulting in the oxidation of our copper matrix.